| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 1-5145165-2 |
| Housing Material: | High Temperature Thermoplastic |
| Number of Contacts: | 184 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Overall Width: | 8.88 mm ;8.88 mm |
| Body Orientation: | Straight |
| Pitch: | .05 in, 1.27 mm |
| Voltage: | 203 V AC |
| Number of Positions: | 184 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Operating Temperature Range: | -55 - 85 °C, -67 - 185 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating: | Tin |
| Connector Height: | 13.97 mm, .55 in |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Connector Length: | 128 mm, 5.039 in |
| Connector System: | Board to Board |
| Connector Width: | .35 in, 8.88 mm |
| Termination Post Tail Length: | .14 in, 3.56 mm |
| PCB Contact Termination Area Plating Thickness: | 2.54 µm |
| Bus Type: | PCI |
| Bus Width: | 64 Bit |
| Ejector: | Without |
| Accepts PCB Thickness: | .062 in, 1.57 mm |
| Part Aliases: | 1-5145165-2 |
| SKU: | AMP1-5145165-2 |
1-5145165-2
Specifications
Detailed Description
This connector assembly features dual positions with a .050 pitch, designed for board-to-board PCB connections in a straight orientation. With a high temperature thermoplastic housing and gold-plated phosphor bronze contacts, it offers reliable signal transmission in demanding environments. The 184 contacts are terminated through hole via soldering, ensuring secure attachment. Operating within a wide temperature range of -55 to 85°C (-67 to 185°F) and rated for 203V AC, this assembly is suitable for various signal circuit applications. Packaged in a box with 35 units, it is RoHS compliant and ideal for use in data and device connectivity setups.

