| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2102775-1 |
| Series: | MULTIGIG RT 2-R |
| Amperage: | 1.5 A |
| Gender: | Plug |
| Number of Contacts: | 56 |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Body Orientation: | Right Angle |
| Pitch: | .075 in, 1.9 mm |
| Row Spacing: | .053 mm, 1.35 in |
| Number of Positions: | 56 |
| Mount Orientation: | Right Angle |
| Operating Temperature Range: | -55 - 125 °C, -67 - 257 °F |
| Circuit Application: | Power & Signal |
| Mating Alignment: | With |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Number of Columns: | 8 |
| Connector System: | Board to Board |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | Fully |
| Guide Location: | Left |
| Part Aliases: | 2102775-1 |
| SKU: | AMP2102775-1 |
2102775-1
Specifications
Detailed Description
This DC connector features a 7-row design with a half-end configuration, ideal for power and signal applications. With 56 contacts in a right-angle orientation, it ensures reliable board-to-board connections. The MULTIGIG RT 2-R series connector, with a pitch of 1.9mm and operating temperature range of -55 to 125°C, is suited for demanding aerospace, defense, and marine environments. Its board mount installation, shrouded and fully guided structure, and 1.5A amperage capacity make it a dependable choice for robust connectivity needs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 07/01/2024 | P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly process | Download | |||
| 11/10/2022 | P-22-023166 - Product improvement. Increase width of the wafer slots on the housing by 0.09mm in order to reduce the risk of FOD (Foreign Object debris) that can be generated by insertion of the wafers during part assembly. | Download | |||
Availability
In Stock:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
Call
Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |