2227667-2

Heilind Number:AMP2227667-2
Manufacturer:TE Connectivity
Manufacturer Number:2227667-2
Datasheet:Product Specification
ECAD Model:
3D Model

Description:

zQSFP+ STACKED RECEPTACLE ASSEMBLY 2X2

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2227667-2
Series:zQSFP+/QSFP28
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Pitch:.032 in, 8 mm
Number of Ports:4
Data Interface:zQSFP+
Contact Amperage:.5 A
Number of Positions:152
Data Rate:28 Gb/s
Application:Standard
GPL:J25
Port Matrix Configuration:2 x 2
Tail Length:.079 in, 2 mm
Packaging:Box & Tray
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin, .76 µm
Contact Underplating Material:Tin
PCB Contact Termination Area Plating:Gold
PCB Thickness (Recommended):.062 in, 1.57 mm
Sealable:No
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:L818
EMI and RFI Protection Type:Internal/External EMI Springs
Connector System:Cable-to-Board
Connector Product Type:Cage Assembly with Integrated Connector
ECCN:EAR99
Cage Type:Stacked
Lightpipe Configuraton:Outer Left Indicator Up
Cage Material:Nickel Silver
Heat Sink Compatible:No
Lightpipe Included:Yes
Enhancements:Standard
Material Flammability Standard:UL 94V-0
Part Aliases:2227667-2
SKU:AMP2227667-2

Detailed Description

Enhance your high-speed data transmissions with this zQSFP+ Stacked Receptacle Assembly. Featuring a 2x2 port matrix configuration, this assembly is designed for seamless board mount installation using a through-hole press-fit termination method. With a pitch of .8mm and a data rate of 28 Gb/s, it offers optimal performance for standard applications. The UL 94V-0 flammability standard ensures safety, while the gold-plated contact mating area guarantees reliable signal transmission. Operating in a wide temperature range from -55 to 105°C, this assembly is suitable for various environments. RoHS compliant and lead-free solder capable, it meets international standards for environmental responsibility. Ideal for use in high-speed connectors and components, this assembly is a must-have for data and devices applications.