3-1734774-0

Heilind Number:AMP3-1734774-0
Manufacturer:TE Connectivity
Manufacturer Number:3-1734774-0
Datasheet:3D Model (STP)
ECAD Model:
3D Model

Description:

PCI EXP 2.3L 64 POS WHT 15u"

More >>

Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 3-1734774-0
Housing Material:PA 9T GF
Mount Type:Board Mount
Termination Method:Through Hole - Solder
Contact Material:Phosphor Bronze
Pitch:.039 in, 1 mm
Voltage:50 V AC
Number of Positions:64
Housing Color:White
Mount Orientation:Vertical
Operating Temperature Range:-40 - 185 °F, -40 - 85 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:15 µin
PCB Contact Termination Area Plating:Tin
PCB Thickness (Recommended):.063 in, 1.6 mm
Connector Height:10 mm, .394 in
Connector and Contact Terminate To:Printed Circuit Board
Connector Length:1.535 in, 39 mm
Connector System:Cable-to-Board
PCB Contact Termination Area Plating Finish:Matte
Connector Width:.346 in, 8.8 mm
Termination Post Tail Length:.091 in, 2.3 mm
PCB Contact Termination Area Plating Thickness:2.54 µm
Bus Type:PCI Express
Ejector:Without
Accepts PCB Thickness:.062 in, 1.57 mm
PCI Generation:II & III
Part Aliases:3-1734774-0
SKU:AMP3-1734774-0

Detailed Description

Upgrade your system with our cutting-edge PCI Express 2.3L 64-position connector, designed for seamless board-to-board connectivity. Boasting a durable PA 9T GF housing in a sleek white finish, this connector ensures reliable performance in any environment, with a wide operating temperature range of -40 to 85°C. Featuring through-hole solder termination and gold-plated phosphor bronze contacts, it guarantees secure and efficient data transmission at a voltage of 50V AC. With a low-profile design measuring just 10mm in height, and a compact form factor, it's perfect for space-constrained applications. RoHS compliant and lead-free solder capable, this connector prioritizes environmental sustainability without compromising on quality. Ideal for PCI Express Gen II and III systems, it's a must-have component for high-speed connectivity in modern electronic devices.