5223513-8

AMP5223513-8
Heilind Number:AMP5223513-8
Manufacturer:TE Connectivity
Manufacturer Number:5223513-8
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

2MMFB,IS,ASY,168,SIG,HDR,SL

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Specifications

AttributeValue
Product Category:
Board To Board PCB Connectors Mezzanine & Board Stacking Connectors
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5223513-8
Series:Z-PACK Future Bus+
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:4
Mount Type:Board Mount
Termination Method:Through Hole - Solder
Contact Material:Phosphor Bronze
Pitch:.079 in, 2 mm
Voltage:30 V AC
Contact Type:Pin
Impedance:168 Ω
Package Quantity:7
Contact Amperage:3 A
Number of Positions:168
Housing Color:Natural
Mount Orientation:Right Angle
Insulation Resistance:4 MΩ
GPL:473
Packaging:Tube
Operating Temperature Range:-67 - 257 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.08 µm, 3.1496 µin
PCB Retention:With
Contact Underplating Material:Nickel
PCB Contact Termination Area Plating:Tin
PCB Thickness (Recommended):.08 in, 1.3 mm
Connector Height:11.2 mm, .44 in
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarization
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:2370
Number of Signal Positions:168
Contact Layout:Matrix
Connector System:Board to Board
Stackable:No
ECCN:EAR99
Dielectric Withstanding Voltage:1000 V AC
Board to Board Configuration:Right Angle
Contact Mating Area Plating Finish:Matte
Connector Width:16 mm, .622 in
PCB Mount Alignment:With
PCB Mount Alignment Type:Locating Posts
Application Solder Feature:Board Standoff
Termination Post Tail Length:.107 in, 2.73 mm
Connector Assembly Type:PCB Mount Header
PCB Contact Termination Area Plating Thickness:150 µin, 3.81 µm
Contact Mating Area Length:.197 in, 5 mm
Material Flammability Standard:UL 94V-0
Part Aliases:5223513-8
SKU:AMP5223513-8

Detailed Description

The Z-PACK Future Bus+ is a high-performance board-to-board connector offering 168 signal positions in a compact, right-angle design. With a pitch of 2mm and gold plating on the contact mating area, it ensures reliable signal transmission in data and device applications. The housing, made of UL 94V-0 rated LCP, provides excellent durability and meets strict flammability standards. Featuring through-hole solder termination and a 30V AC voltage rating, this connector is suitable for a wide range of operating environments. Its polarization and mating alignment features ensure easy and secure assembly, while the inclusion of PCB retention and board standoff application solder features further enhance its usability. RoHS compliant and with a high dielectric withstanding voltage of 1000V AC, the Z-PACK Future Bus+ is a reliable and versatile choice for demanding PCB connectivity needs.