| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223660-5 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Socket |
| Impedance: | 120 Ω |
| Package Quantity: | 8 |
| Contact Amperage: | 3 A |
| Number of Positions: | 120 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 4 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 29.921 µin, .76 µm |
| PCB Retention: | With |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 2.4 mm, .76 in |
| Connector Height: | 14.3 mm, .562 in |
| PCB Retention Type: | Solder Tail |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | D021 |
| Number of Signal Positions: | 120 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Vertical |
| Connector Contact Load Condition: | Fully Loaded |
| Contact Mating Area Plating Finish: | Matte |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Termination Post Tail Length: | .126 in, 3.2 mm |
| Connector Assembly Type: | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Thickness: | 150 µin, 3.81 µm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223660-5 |
| SKU: | AMP5223660-5 |
5223660-5
Specifications
Detailed Description
Enhance your PCB connectivity with the Z-PACK Future Bus+ Board-to-Board Connector. With a durable LCP housing and four rows of 120 phosphor bronze contacts, this connector ensures reliable signal transmission. The through-hole solder termination method and UL 94V-0 flammability standard compliance guarantee secure and safe installation. Operating in a wide temperature range from -67 to 257 °F, it's suitable for various environments. Gold-plated contact mating areas with a thickness of .76 µm provide excellent conductivity, while the 2 mm pitch and 120 Ω impedance support efficient data transfer. Whether for data or device applications, this vertical mount connector offers versatility and performance. With a mating alignment system and polarization feature, it ensures correct and stable connections. Ideal for signal circuitry, this connector is a key component for your electronics projects.

