5767121-4

Heilind Number:AMP5767121-4
Manufacturer:TE Connectivity
Manufacturer Number:5767121-4
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

MICT,PLG,152,ASY,.025,TAPE CAP

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5767121-4
Housing Material:Matte
Number of Rows:2
Mount Type:Board Mount
Termination Method:Surface Mount
Contact Material:Copper Alloy
Pitch:24.003 mm, .64 mm, .945 in
Voltage:30 V AC
Contact Type:Pin
Row Spacing:.228 in, 5.79 mm
Impedance:50 Ω
Contact Amperage:11.5 A
Number of Positions:152
Data Rate:10 Gb/s
Housing Color:Black
Mount Orientation:Vertical
Insulation Resistance:2 MΩ
Mating Entry Location:Top
Operating Temperature Range:-67 - 257 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:29.921 µin, .76 µm
PCB Retention:With
PCB Contact Termination Area Plating:Tin
PCB Thickness (Recommended):1.57 mm, .8 in
Connector Height:12.29 mm, .484 in
Sealable:No
Ground Component Type:Ground Bus
Mating Alignment:Without
Connector and Contact Terminate To:Printed Circuit Board
Number of Columns:76
Number of Power Positions:4
Number of Signal Positions:152
Contact Layout:Inline
Connector Length:2.498 in, 63.45 mm
Connector System:Board to Board
Stackable:Yes
Dielectric Withstanding Voltage:500 V AC
Board to Board Configuration:Mezzanine
Contact Mating Area Plating Finish:Matte
Contact Shape:Dual Beam
PCB Contact Termination Area Plating Finish:Matte
Connector Width:.208 in, 5.2832 mm
Mating Retention:With
PCB Mount Alignment:With
PCB Mount Alignment Type:Locating Posts
Differential Signaling:Yes
Header Type:Header Only
Connector Assembly Type:PCB Mount Header
Stack Height:12.57 mm, 21.6 mm, .85 in
PCB Contact Termination Area Plating Thickness:150 – 250 µin, 3.81 - 6.35 µm
Contact Mating Area Length:.035 in, .891 mm
Standards Met:CSA
Material Flammability Standard:UL 94V-0
Part Aliases:5767121-4
SKU:AMP5767121-4

Detailed Description

Enhance your signal connectivity with this high-performance MICT, PLG connector, featuring 152 positions for seamless board-to-board integration. With a pitch of .64mm and impedance of 50 Ω, it ensures reliable data transmission at speeds up to 10 Gb/s. The contact layout is inline, with a dual-beam contact shape for optimal conductivity. Its durable housing, meeting UL 94V-0 flammability standards, is designed for vertical board mount orientation, with a connector height of .484 inches. Gold plating on the contact mating area guarantees excellent signal transfer, while PCB retention with tin plating ensures secure assembly. Operating in a wide temperature range from -67 to 257°F, this connector is ideal for various signal circuit applications. Its stackable design and mezzanine board-to-board configuration offer flexibility in system integration. Trust in its CSA and UL agency certifications for quality assurance.