767115-4

Heilind Number:AMP767115-4
Manufacturer:TE Connectivity
Manufacturer Number:767115-4
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

MICT,REC,152,ASY,.025 TAPE PKG

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 767115-4
Housing Material:Liquid crystal polymer(LCP)
Number of Rows:2
Mount Type:Board Mount
Termination Method:Surface Mount
Contact Material:Copper Alloy
Pitch:24.003 mm, .64 mm, .945 in
Voltage:30 V AC
Contact Type:Socket
Row Spacing:.228 in, 5.79 mm
Impedance:50 Ω
Contact Amperage:11.5 A
Number of Positions:152
Data Rate:10 Gb/s
Housing Color:Black
Mount Orientation:Vertical
Insulation Resistance:2 MΩ
Mating Entry Location:Bottom
Operating Temperature Range:-67 - 257 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold or Palladium Nickel or Performance Based
Contact Mating Area Plating Thickness:.12 µm, 5 µin
PCB Retention:With
PCB Contact Termination Area Plating:Tin-Lead
PCB Thickness (Recommended):1.57 mm, .8 in
Connector Height:.24 in, 6.096 mm
Sealable:No
Ground Component Type:Ground Bus
Mating Alignment:Without
Connector and Contact Terminate To:Printed Circuit Board
Number of Columns:76
Number of Power Positions:4
Number of Signal Positions:152
Contact Layout:Inline
Connector Length:2.498 in, 63.45 mm
Connector System:Board to Board
Stackable:No
Board to Board Configuration:Mezzanine
Contact Shape:Dual Beam
Connector Width:.272 in, 6.9 mm
Mating Retention:With
PCB Mount Alignment:With
PCB Mount Alignment Type:Locating Posts
Application Assembly Feature:Pick and Place Cover
Differential Signaling:Yes
Header Type:Header Only
Connector Assembly Type:PCB Mount Receptacle
Stack Height:10.92 mm, 12.57 mm, 17.96 mm, 18.75 mm, 20 mm, 22.86 mm, 6.6 mm, .9 in, 9 mm
PCB Contact Termination Area Plating Thickness:150 - 250 µin
Standards Met:CSA
Material Flammability Standard:UL 94V-0
Part Aliases:767115-4
SKU:AMP767115-4

Detailed Description

Enhance signal transmission in your circuit with this high-performance MICT,REC board-to-board connector. Featuring 152 contact positions with a pitch of .64mm, it ensures reliable connectivity for data rates up to 10 Gb/s. The contact layout is inline, with dual-beam shape for secure mating. With a voltage rating of 30V AC and 4V DC, it meets stringent CSA standards for quality and safety. The housing, made of UL 94V-0 rated liquid crystal polymer in sleek black, offers robust protection. Surface mount termination and header-only assembly make installation easy, while its board-to-board configuration with mezzanine stack height of .9 inches suits various applications. Whether for data and devices or signal transmission, this connector is a versatile solution.