DMC-M 01-08 PC

Heilind Number:DCHDMC-M 01-08 PC
Manufacturer:TE Connectivity | Deutsch
Manufacturer Number:DMC-M 01-08 PC
Datasheet:Material Declaration
ECAD Model:
3D Model

Description:

DMC-M 01-08 PC

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity | Deutsch
Manufacturer Part Number:TE Connectivity | Deutsch DMC-M 01-08 PC
Connector Type:Connector Assembly
Housing Material:Aluminum
Number of Rows:1
Termination Method:Crimp
Contact Plating:Gold Over Nickel
Pitch:1 in, 25.4 mm
Voltage:125 V AC, 125 V DC
Contact Size:8
Strain Relief:No Strain Relief
Row Spacing:16 mm, .6299 in
Keying:C
Shape:Rectangular
Contact Amperage:46 A
Number of Positions:1
GPL:AC8
Operating Temperature Range:-65 - 175 °C, -85 - 392 °F
Circuit Application:Power & Signal & Data
Sealable:Yes
GPL Description:Aerospace Defense & Marine
Connector and Contact Terminate To:Wire & Cable
Product Code:EB17
Number of Columns:1
Number of Power Positions:1
Wire Size:8.98 - 5.3 mm², 8 AWG
Contact Layout:Matrix
Connector Product Type:Pin Insert Module
ECCN:EAR99
Contact Style:Crimp
Contact Retention:With
Contact Retention Type:Retention Clip
Module Material:Composite
Number of Cavities:1
Box Mount:No
Prewired:No
Part Aliases:ZPF000000000015170
SKU:DCHDMC-M 01-08 PC

Detailed Description

Introducing the DMC-M 01-08 PC Connector, a versatile and reliable solution for your power, signal, and data applications. With its durable aluminum housing and gold-plated contacts, this connector ensures optimal performance in demanding environments. Featuring a crimp termination method and a single-row design, it offers easy installation and space-saving efficiency. Rated for 125V AC/DC and capable of handling currents up to 46A, it is suitable for a wide range of applications. Sealable and with a retention clip for added security, this connector is ideal for aerospace, defense, and marine use. Its composite module material and compatibility with 8 AWG wire size guarantee secure connections. Trust in the DMC-M 01-08 PC Connector for seamless connectivity in your systems.