170071-1012

Heilind Number:MOL170071-1012
Manufacturer:Molex
Manufacturer Number:170071-1012
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

zSFP+ Stacked Ganged Assembly with Elastomeric Gasket, 2-by-1 with Inner Light Pipes, 40 Circuits

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 170071-1012
Color:Black
Series:170071 - zSFP Plus - zSFP
Amperage:.5 A
Connector Type:zSFP Plus
Gender:Female
Number of Rows:2
Termination Method:Through Hole - Compliant Pin
Contact Material:High Performance Alloy (HPA)
Pitch:8 mm
Voltage:30 V AC
Material:Thermoplastic
Number of Ports:2
Orientation:Right Angle
Component Type:Receptacle
Operating Temperature Range:-40 - 85 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:40
Mating Cycles:100
PCB Locator:Yes
Shielded:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:.762 µm
Polarized to Mate:Yes
PCB Thickness (Recommended):2.36 mm
Connector System:Module to Board
Contact Termination Plating:Matte Tin
Termination Pitch:.8 mm
Electrical Model:Yes
Lock to Mating Part:Yes
Surface Mount Compatible:No
Material Flammability Standard:94V-0
Part Aliases:1700711012
SKU:MOL170071-1012

Detailed Description

Elevate your connectivity with this zSFP+ Stacked Ganged Assembly. Designed for high-speed data transmission, this assembly boasts 40 circuits and features an innovative 2-by-1 configuration with inner light pipes for enhanced functionality. The female connector, crafted with high-performance alloy, ensures reliable power delivery at a maximum amperage of 0.5 A and voltage of 30 V AC. Its right-angle orientation and through-hole termination method offer versatile installation options, while its thermoplastic construction guarantees durability in a wide operating temperature range. With gold plating on the mating area and matte tin on the termination, this assembly not only ensures optimal signal transfer but also meets RoHS compliance for environmental responsibility. Perfect for demanding applications, from telecommunications to industrial automation, this connector system is a key component in your high-speed data infrastructure.