170673-2108

MOL170673-2108
Heilind Number:MOL170673-2108
Manufacturer:Molex
Manufacturer Number:170673-2108
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

EdgeLine Vertical Connector, 12.5 Gbps, 0.80mm Pitch, 1.57mm PCB Thickness, 2 Bays, 108 Circuits

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Specifications

AttributeValue
Product Category:
Board To Board PCB Connectors Card Edge Connectors
Manufacturer:Molex
Manufacturer Part Number:Molex 170673-2108
Color:Black
Series:170673 - EdgeLine
Amperage:1.5 A
Connector Type:EdgeLine
Housing Material:Thermoplastic
Number of Contacts:108
Termination Method:Through Hole - Compliant Pin
Contact Material:Copper Alloy
Contact Plating:Gold Over Nickel
Body Orientation:Straight
Pitch:8 mm
Voltage:250 VAC
Material:High Temperature Thermoplastic
Orientation:Vertical
Component Type:Edgecard to PCB
Data Rate:12.5 - 20 Gb/s
Operating Temperature Range:-40 - 105 °C
Contact Mating Area Plating:Gold over Nickel
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:108
Mating Cycles:200
PCB Locator:No
Contact Termination Plating Thickness:.762 µm
Polarized to Mate:Yes
PCB Thickness (Recommended):2.79 mm
Contact Termination Plating:Tin
Termination Pitch:.8 mm
Power and Signal Configuration:108 s - 0 p
Edge Card Thickness:1.57 mm
Standards Met:General
Material Flammability Standard:94V-0
Part Aliases:1706732108
SKU:MOL170673-2108

Detailed Description

Enhance your connectivity with the EdgeLine Vertical Connector, boasting a high-speed data rate of up to 12.5 Gb/s. Designed for optimal performance, this connector features 108 circuits, ensuring seamless power and signal configuration. Its durable construction, with a thermoplastic housing and gold-plated copper contacts, guarantees reliability in any application. With compliance to RoHS standards and certifications from CSA and UL agencies, you can trust in its quality and safety. Perfect for board-to-board connections, this straight orientation connector with a .8mm pitch and through-hole termination method is ideal for applications requiring secure and efficient data transmission. Elevate your connectivity solutions with this essential component.