171814-1008

Heilind Number:MOL171814-1008
Manufacturer:Molex
Manufacturer Number:171814-1008
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

3.96mm Pitch, KK 396 RPC Wire-to-Board Right-Angle Header with Friction Lock, 15µm Gold (Au) Plating, Bag, 8 Circuits

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 171814-1008
Color:Black
Series:171814 - KK 396
Amperage:7 A
Connector Type:KK 396
Number of Contacts:8
Number of Rows:1
Termination Method:Through Hole
Body Orientation:Right Angle
Pitch:3.96 mm
Voltage:250 V
Material:Nylon
Orientation:Right Angle
Keying:No
Operating Temperature Range:-40 - 105 °C
Circuit Application:Signal
Contact Mating Area Plating:Gold
Number of Contacts Loaded:8
Mating Cycles:25
PCB Locator:No
PCB Retention:Without
PCB Thickness (Recommended):1.6 mm
Connector System:Wire to Board
Contact Termination Plating:Nickel
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Duration at Max. Process Temperature (seconds):030
Max. Cycles at Max. Process Temperature:003
Glow Wire Capable:No
Guide to Mating Part:No
Lock to Mating Part:Yes
Stackable:No
Surface Mount Compatible:Yes
Breakaway:No
Make First / Break Last:No
Shroud Type:Partial
Material Flammability Standard:94V-1
Part Aliases:1718141008
SKU:MOL171814-1008

Detailed Description

Enhance your electronic connections with this versatile KK 396 right angle pin header, featuring eight gold-plated contacts for reliable signal transmission. Designed for through-hole termination on PCBs, this connector offers a secure fit with a 3.96mm pitch. With a high amperage rating of 7A and a voltage capacity of 250V, it ensures efficient power delivery. Crafted from durable nylon with nickel-plated contact termination, it withstands harsh operating conditions from -40 to 105°C. RoHS compliant and suitable for lead-free solder processes, it guarantees both performance and environmental responsibility. Perfect for wire-to-board applications, this connector embodies quality and longevity in electronic assemblies.