30700-5167

Heilind Number:MOL30700-5167
Manufacturer:Molex
Manufacturer Number:30700-5167
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

2.54mm Pitch, H-DAC 64 High Density Automotive Header, Dual Row, Right-Angle, 16 Circuits, Polarization Option 1, Gray, Tray

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 30700-5167
Color:Gray
Series:30700 - H-DAC 64
Amperage:7 A
Connector Type:H-DAC 64
Number of Contacts:16
Number of Rows:2
Termination Method:Through Hole
Contact Material:Copper
Body Orientation:Right Angle
Pitch:2.54 mm
Voltage:500 V DC
Material:Modified Polystyrene
Orientation:Right Angle
Keying:No
Tail Length:3.69 mm
Operating Temperature Range:-40 - 100 °C
Contact Mating Area Plating:Tin
Number of Contacts Loaded:16
Mating Cycles:10
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Polarized to Mate:Yes
PCB Thickness (Recommended):1.57 mm
Connector System:Wire to Board
Contact Termination Plating:Nickel
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:SMC and Wave
Duration at Max. Process Temperature (seconds):040
Max. Cycles at Max. Process Temperature:003
Glow Wire Capable:No
Guide to Mating Part:No
Lock to Mating Part:Yes
Stackable:No
Surface Mount Compatible:No
Breakaway:No
Make First / Break Last:No
Shroud Type:Fully
Part Aliases:0307005167
SKU:MOL30700-5167

Detailed Description

Easily connect your components with our H-DAC 64 Right Angle Connector. With 16 contacts in a 2-row configuration, this connector has a robust design suitable for high-power applications, with a 7A current rating and 500V DC voltage. Made with durable materials like Modified Polystyrene and Copper, it ensures reliable performance even in demanding environments. Featuring through-hole termination and PCB locator for easy installation, it's ideal for wire-to-board connections. With RoHS compliance and lead-free soldering capability, it meets international standards for environmental responsibility. Trust in this connector for secure and efficient connectivity in your projects.