44067-1203

MOL44067-1203
Heilind Number:MOL44067-1203
Manufacturer:Molex
Manufacturer Number:44067-1203
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm Thick PCB, 12 Circuits, 0.76µm Gold (Au) Selective Plating

Specifications

AttributeValue
Product Category:
PC Board Pin & Receptacle Connectors PCB Pin Headers
Manufacturer:Molex
Manufacturer Part Number:Molex 44067-1203
Color:Black
Pitch:3 mm
Keying:No
Series:44067
Voltage:250 V
Amperage:8.5 A
Material:High Temperature Thermoplastic
Shroud Type:Fully
Breakaway:No
Stackable:No
Orientation:Vertical
PCB Locator:Yes
Tail Length:4.01 mm
Product Name:Micro-Fit 3.0
Mating Cycles:30
PCB Retention:Yes
PCB Thickness (Recommended):3.6 mm
Connector Type:Micro-Fit 3.0
Number of Rows:2
Body Orientation:Straight
Connector System:Wire to Board
Polarized to PCB:Yes
Glow Wire Capable:No
Termination Pitch:3 mm
Number of Contacts:12
Termination Method:Through Hole - Kinked Pin
Lock to Mating Part:Yes
Guide to Mating Part:No
Make First / Break Last:No
Surface Mount Compatible:Yes
Number of Contacts Loaded:12
Contact Mating Area Plating:Gold
Contact Termination Plating:Tin
Operating Temperature Range:-40 - 105 °C
Duration at Max. Process Temperature (seconds):030
Lead Free Process Capability:SMC and Wave
Contact Mating Area Plating Thickness:.762 µm
Contact Termination Plating Thickness:2.540 µm
Max. Cycles at Max. Process Temperature:003
Maximum Solder Process Temperature:260 °C
Part Aliases:44067-1203 0440671203 44067
SKU:MOL44067-1203