| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 73644-1012 |
| Color: | Black, Natural |
| Pitch: | 2 mm |
| Keying: | Yes |
| Series: | 73644 - HDM |
| Voltage: | 250 VAC |
| Amperage: | 1 A |
| Material: | High Temperature Thermoplastic |
| Shielded: | No |
| Data Rate: | 1 Gb/s |
| Stackable: | Yes |
| Orientation: | Vertical |
| PCB Locator: | No |
| Tail Length: | 3.5 mm |
| Mating Cycles: | 250 |
| PCB Retention: | Yes |
| PCB Thickness (Recommended): | 2.5 mm |
| Component Type: | PCB Header |
| Connector Type: | HDM |
| Number of Rows: | 6 |
| Contact Plating: | Gold |
| Number of Pairs: | Open Pin Field |
| Contact Material: | Phosphor Bronze, Stainless Steel |
| Polarized to PCB: | No |
| Number of Columns: | 24 |
| Termination Pitch: | 2 mm |
| Number of Contacts: | 144 |
| Termination Method: | Through Hole - Compliant Pin |
| Guide to Mating Part: | Yes |
| Make First / Break Last: | No |
| Surface Mount Compatible: | Yes |
| Number of Contacts Loaded: | 144 |
| Contact Mating Area Plating: | Gold |
| Contact Termination Plating: | Gold |
| Operating Temperature Range: | -55 - 105 °C |
| Board to Board Configuration: | Backplane |
| Maximum Operating Temperature: | 105 °C |
| Minimum Operating Temperature: | -55 °C |
| Contact Mating Area Plating Thickness: | .762 µm |
| Contact Termination Plating Thickness: | .051 µm |
| Part Aliases: | 0736441012 |
| Material Flammability Standard: | 94V-0 |
| SKU: | MOL73644-1012 |
73644-1012
Specifications
Detailed Description
Enhance your board-to-board connectivity with our HDM Backplane Header. Designed for vertical installation, this header features a sturdy SMC housing in black or natural color options. With Press-Fit termination and a high contact count of 144 circuits spread across 6 rows, it ensures reliable power and signal transfer. The Phosphor Bronze and Stainless Steel contacts with Gold plating guarantee high conductivity, while the 2mm pitch and 1A amperage rating cater to demanding applications. Operating efficiently in temperatures ranging from -55°C to 105°C, it's suitable for diverse environments. This component, with its Polarizing Key, Guide Post, and stackable design, offers ease of installation and ensures proper mating. RoHS compliant and certified by CSA and UL agencies, it meets stringent quality standards for your peace of mind. Explore seamless connectivity solutions with our HDM Backplane Header.
Frequently Bought Together
| Product | Part # | Description | Stock |
|---|---|---|---|
| Molex 73642-1000 | HDM Board-to-Board Backplane Header, Vertical, Press-Fit, Open End, 144 Circuits | ![]() |
| Molex 73644-1004 | HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position C, 144 Circuits, Mating Length 5.00mm | ![]() |
| Molex 73644-1005 | HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position C, 144 Circuits, Mating Length 5.00mm | ![]() |
| Molex 73644-1008 | HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position E, 144 Circuits, Mating Length 5.00mm | ![]() |
| Molex 73644-1009 | HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position E, 144 Circuits, Mating Length 5.00mm | ![]() |
| Molex 73644-1013 | HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position G, 144 Circuits, Mating Length 5.00mm | ![]() |
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 11/18/2025 | 516838 - Equipment Transfer, Production Transfer or Rearrangement. equipment transfer that have been used to manufacture impacted part(s). No changes will be made to product as part of this change. | Download | |||
| 12/30/2023 | 514258 - Change Supplier. This notification is to inform you this is a change regarding the supplier. Please refer to the details below. | Download | |||
| 09/20/2022 | 512191 - Packaging Method/Quantity Changing. Molex will replace the top locked cartons with normal standard cartons. Carton size / packaging quantity and packaging materials remain unchanged. No changes will be made to the part design and will not affect the use or disposal of inventory. | Download | |||


