73650-0060

Heilind Number:MOL73650-0060
Manufacturer:Molex
Manufacturer Number:73650-0060
Datasheet:RoHS Certificate of Compliance
ECAD Model:
3D Model

Description:

144POS HDM BACKPLANE MODULE 736500060

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 73650-0060
Series:73650
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:REFLOW
Part Aliases:0736500060
SKU:MOL73650-0060

Detailed Description

Elevate your PCB connectivity with this high-performance board-to-board connector. Designed for seamless integration, it ensures reliable signal transmission in demanding applications. With a lead-free process capability and ROHS compliance, it meets stringent environmental standards. The connector's robust construction, coupled with a maximum solder process temperature of 260°C, guarantees durability and stability even in harsh operating conditions. Ideal for backplane setups, it offers a secure and efficient solution for your connectivity needs. Upgrade your system with this essential component for enhanced performance and longevity.