73780-1237

Heilind Number:MOL73780-1237
Manufacturer:Molex
Manufacturer Number:73780-1237
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits, Mounted Height 17.00mm, Pin Length 2.50mm, Solder Tail

Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 73780-1237
Color:Black
Pitch:2 mm
Keying:No
Series:73780 - HDM
Voltage:250 VAC
Amperage:15 A, 1 A
Material:High Temperature Thermoplastic
Shielded:No
Data Rate:1 Gb/s
Stackable:Yes
Orientation:Vertical
PCB Locator:No
Tail Length:2.5 mm
Mating Cycles:250
PCB Retention:Without
PCB Thickness (Recommended):1.6 mm
Component Type:PCB Receptacle
Connector Type:HDM
Number of Rows:6
Contact Plating:Gold
Number of Pairs:Open Pin Field
Contact Material:Copper-Nickel-Tin
Polarized to PCB:No
Number of Columns:24
Termination Pitch:2 mm
Number of Contacts:144
Termination Method:Through Hole
Guide to Mating Part:No
Make First / Break Last:No
Surface Mount Compatible:Yes
Number of Contacts Loaded:144
Contact Mating Area Plating:Gold
Contact Termination Plating:Tin
Operating Temperature Range:-55 - 105 °C
Board to Board Configuration:Daughtercard, Mezzanine
Duration at Max. Process Temperature (seconds):005
Lead Free Process Capability:WAVE
Maximum Operating Temperature:105 °C
Minimum Operating Temperature:-55 °C
Contact Mating Area Plating Thickness:.762 µm
Contact Termination Plating Thickness:2.540 µm
Max. Cycles at Max. Process Temperature:001
Maximum Solder Process Temperature:260 °C
Part Aliases:73780-1237 0737801237
Material Flammability Standard:94V-0
SKU:MOL73780-1237