| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 87970-0001 |
| Color: | Black |
| Series: | 87970 - SAS 6G |
| Amperage: | 1.5 A |
| Connector Type: | SAS 6G |
| Gender: | Female |
| Number of Contacts: | 29 |
| Number of Rows: | 2 |
| Mount Type: | Panel Mount |
| Termination Method: | Through Hole |
| Contact Material: | High Temperature Thermoplastic, Phosphor Bronze |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 55 °C |
| Minimum Operating Temperature: | 0 °C |
| Body Orientation: | Straight |
| Pitch: | 1.27 mm, 8 mm |
| Voltage: | 30 V |
| Orientation: | Vertical |
| Keying: | Yes |
| Component Type: | Receptacle |
| Tail Length: | 2.2 mm, 2.7 mm |
| Operating Temperature Range: | 0 - 55 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 29 |
| Mating Cycles: | 500 |
| PCB Locator: | Yes |
| Shielded: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1.8 mm |
| Connector System: | Board to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | SMC and Wave |
| Duration at Max. Process Temperature (seconds): | 010 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Termination Pitch: | 1.27 mm, .8 mm |
| Lock to Mating Part: | No |
| Surface Mount Compatible: | Yes |
| Waterproof Dustproof: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 87970-0001 0879700001 |
| Contact Detail: | Signal 14, Power 15 |
| SKU: | MOL87970-0001 |
87970-0001
| Heilind Number: | MOL87970-0001 |
| Manufacturer: | Molex |
| Manufacturer Number: | 87970-0001 |
| Datasheet: | Datasheet |
| ECAD Model: |
Description:
1.27mm Signal Pitch, 0.80mm SCSI Pitch, 1.27mm Power Pitch SAS-2 Receptacle, Vertical, Through Hole, with Straight Solder Tab, 29 Circuits, Lead-Free
Specifications
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 02/28/2023 | 511683REV1 - Obsolete. no replacement LTB: 11/28/22 LTS: 2/28/23 | Download | |||
| 12/01/2015 | GCM 10724605 - Supplier Changes To Raw Material. This letter is to informed you that there is a change in manufacturing location from Malaysia to China for plastic resin used in the products listed in the attachment initiated by the plastic resin maker. There is no impact to the product form, fit and function as the raw plastic resin material composition remains unchanged. Brand name is changed as well from Vectra to LAPEROS. | Download | |||
| 08/31/2014 | GCM 10639277 - Tooling / Equipment Transfer. The purpose of this letter is to inform you that a change of manufacturing location from Singapore to Johor, Malaysia by the terminal stamping sub-con will be implemented. This letter takes the place of notice to customer the reason of change is due to terminal stamping sub-con is ceasing production in Singapore and shifting to Johore, Malaysia which is also a Molex qualifed manufacturing site. We verify impact of the change is confirmed as no impact to the quality of products shipped. This GCN issued based on the terminal part number 87839. Please refer to the attached list or IAR for the finished goods part number. | Download | |||

