90136-1426

Heilind Number:MOL90136-1426
Manufacturer:Molex
Manufacturer Number:90136-1426
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

C-Grid III Header, Single Row, Vertical, Shrouded, 26 Circuits, Flash 0.10µm Gold (Au) Selective Plating

More >>

Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 90136-1426
Color:Black
Series:90136 - C-Grid III
Amperage:3 A
Connector Type:C-Grid III
Number of Contacts:26
Number of Rows:1
Termination Method:Through Hole
Contact Material:Brass
Pitch:2.54 mm
Voltage:350 V AC/DC
Material:Polyester
Orientation:Vertical
Keying:No
Tail Length:2.9 mm
Contact Mating Area Plating:Gold
Number of Contacts Loaded:26
PCB Locator:No
PCB Retention:Without
Polarized to PCB:No
Contact Termination Plating Thickness:3.048 µm
PCB Thickness (Recommended):1.6 mm
Connector System:Wire to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:235 °C
Lead Free Process Capability:WAVE
Duration at Max. Process Temperature (seconds):003
Max. Cycles at Max. Process Temperature:001
Termination Pitch:2.54 mm
Glow Wire Capable:No
Guide to Mating Part:No
Lock to Mating Part:Yes
Stackable:No
Breakaway:No
Make First / Break Last:No
Shroud Type:Fully
Part Aliases:0901361426
SKU:MOL90136-1426

Detailed Description

Experience seamless connectivity with our C-Grid III Header, designed for optimal performance. With a single row, vertical orientation and shrouded construction, it ensures secure and reliable connections. Featuring 26 circuits with Flash 0.10µm Gold (Au) Selective Plating, each contact guarantees efficient signal transmission. Made of durable polyester and brass materials, it offers a maximum amperage of 3A and voltage of 350V AC/DC, perfect for various applications. With a pitch of 2.54mm and through-hole termination, installation is a breeze. RoHS compliant and lead-free process capable, this connector prioritizes both performance and environmental responsibility. Whether for industrial or commercial use, trust in our C-Grid III Header for seamless connectivity solutions.