Molex Fit Families

A wide range of OEMs require power connectors that also support design flexibility. To meet these needs, Fit Family Connectors offer colored polarized housings with isolated terminals, TPAs, positive locks and tangless terminals.
Common Advantages and Features
Polarization and Keying
Reduces the possibility of misalignment. Virtually eliminates misalignment and significantly reduces the number of errors associated with improper installation Polarization AND Keying.
Multiple Contact Points
Provide a variety of critical contact points between the terminal and the mating contact-point application. Multiple current paths have significant advantages over contact systems with fewer paths or with only two paths
Tangless Terminals
Protect terminals for manufacturers and cable harness assembly teams during packaging and assembly insertion. Save time and money by reducing failures associated with locking wings on electrical terminals Tangless Terminals.
Reflow-Capable Headers
Reduce processing requirements and costs. Reflow soldering is reliable and effective for all pitches of leads and pads, enabling very highquality circuit boards
Terminal Position Assurance (TPA)
Helps ensure terminals are fully seated in their housing to reduce back-out; retains terminals if main retention feature fails. Improves the quality of assembly to avoid back-out issues.
Nano-Fit
Features
Features
- 2.50mm pitch
- 8.0A, 250V
- 2 to 16 circuits
- 26 to 20 AWG
- Wire-to-Board
- Wire-to-Wire
- SMT, through hole
- 115°C Reflow capable
Micro-Fit
Features
Features
- 3.00mm pitch
- 10.5A, 600V
- 2 to 24 circuits
- 30 to 18 AWG
- Wire-to-Board
- Wire-to-Wire
- Board-to-Board
- SMT, through hole CPI
- 125°C Reflow capable
- Blind-mating version
Ultra-Fit
Features
Features
- 3.50mm pitch
- 14.0A, 600V
- 2 to 16 circuits
- 22 to 16 AWG
- Wire-to-Board, through hole
- 120°C Reflow capable
- Tangless and 6-point contact design
Mini-Fit
Features
Features
- 4.20mm pitch
- 13.0A, 600V
- 2 to 24 circuits
- 28 to 16 AWG
- Wire-to-Board
- Wire-to-Wire
- Board-to-Board
- Through hole, Press fit
- 125°C Reflow capable
- Wide variety portfolio
Mega-Fit
Features
Features
- 5.70mm pitch
- 26.0A, 600V
- 2 to 12 circuits
- 16 to 12 AWG
- Wire-to-Board
- Wire-to-Wire
- Through hole
- 120°C Reflow capable
- Tangless and 6-point contact design